SonicEdge Announces Semiconductor Integration Partnership at CES
Binyamina-Giv’at Ada, Israel, 6 January 2026 – SonicEdge, a pioneer in micro-acoustic innovation, announced today at CES 2026 a new strategic partnership with a leading global semiconductor manufacturer to integrate its modulated ultrasound IP directly into next-generation audio chipsets. The audio chipset will natively drive SonicEdge’s modulated ultrasound speakers. Additional major chip companies are expected […]
SonicEdge and Earfab Partner to Shape the Future of Personalized Audio and Hearing Wellness
Binyamina-Giv’at Ada, Israel, 9 December 2025 SonicEdge, a pioneer in micro-acoustic innovation, today announced a strategic partnership with Earfab, the innovator of custom- fit hearing technology, to co-develop a new generation of personalized audio solutions that unite comfort, precision, and hearing safety. By combining SonicEdge’s high-performance MEMS speaker-in-chip technology with Earfab’s custom-fit eartips – crafted […]
Coreform Cubit Enables High Fidelity Modeling of Advanced Acoustic Devices
SonicEdge Announces Expanded Sample Availability of the Patented SonicTwin Module
Balancing miniaturization with exceptional audio performance, the solution offers select partners a major competitive edge in today’s market Binyamina-Giv’at Ada, Israel, 23 October 2025 – SonicEdge, a pioneer in micro-acoustic innovation, today announced it is selectively expanding its sample availability of SonicTwin (ST100M), its next-generation integrated speaker and microphone technology for earphones and wearable devices. Already being evaluated […]
Eliminating Ultrasound Concerns in Modulated Ultrasound Speakers
SonicEdge is a breakthrough in speaker design. Instead of using heavy, vibrating parts to create sound, it uses ultrasonic waves to move air more efficiently. The result: high-quality sound from a speaker that’s a fraction of the size of today’s options. Traditional speakers rely on mechanical membrane vibration at audio frequencies, creating inherent trade–offs between […]
Revolutionizing speakers with ultrasound and MEMS
🎯 Perfect for wearables, hearing aids, IoT, and consumer electronics⚡️ Powered by standard MEMS manufacturing🧠 Modeled with precision using COMSOL and validated through real-world measurements💡 Enables simpler audio system design with consistent output across the spectrumWhether you’re an audio engineer, product designer, or innovation leader, SonicEdge gives you a new foundation to build on.
IDTechEx Analyst Report Spotlights SonicEdge’s Game-Changing MEMS Audio Tech
The profile explores how SonicEdge is moving beyond legacy coil-based speaker design to deliver full-range sound from a chip-scale form factor—with implications for TWS earbuds, AR glasses, and the future of embedded audio. Special thanks to Mika Takahashi at IDTechEx for the thoughtful write-up.
Unlocking Next-Gen ANC Performance with MEMS Technology
What you’ll learn: Why traditional moving coil drivers fall short in feedback ANC How MEMS technology enables high-frequency noise cancellation The design benefits of a fully integrated mic + driver module Real performance comparisons in latency, group delay, and more Whether you’re designing the next generation of TWS earphones or evaluating component technologies for ANC-enabled […]
SonicEdge Develops Miniature Mics For Use In Wireless Earbuds
The company’s products use the same silicon technology found in miniature devices using the same reliable silicon technology powering billions of smart devices worldwide. Whether it’s smartphones or cars, these tiny components can be used to create high-quality audio products on a large scale.
Modulated ultrasound speakers – A common framework for analyzing air pump speakers
Active modulation of ultrasound provides an alternative to dynamic drivers and enables to reduce the size and volume of speakers. This feat in apparent contradiction to basic acoustics. In the article we provide for the first time an explanation of the underlying physics of modulated ultrasound speakers using a holistic lumped element model. Using the […]
