We have eliminated lead in all parts of the product and in all phases of the production, protecting people and environment
SonicTwin is the first and only combined microphone/speaker unit. It is 10 times smaller than all traditional solutions in the market. 10 times smaller than the smallest competitor. Yet powerfull, with no audible distortion.
We have been thinking in production from the very beginning of the product development. Our speaker uses the tested and trusted technology used in billions of MEMS microphones. When SonicTwin is released it is ready for high volume scaling.
It’s a well-known fact that microphones and speakers are incompatible, if they share the same surface. Vibrations from the loudspeaker can transfer through the structure and into the microphone, causing rumbling and distortion unrelated to the intended sound source. As the SonicEdge MEMS ultrasound loudspeaker creates no vibrations, the problem is solved. The MEMS microphones and loudspeakers are best friends, not enemies.
• Wide Bandwidth (5Hz to 50kHz)
• High SPL
• Low Harmonic Distortion (THD)
• Small Mechanical Dimensions
• Digital Audio Input and Output
• SMT Compatible
• Small back-volume
• Ideal for ANC applications
• Negligible Mechanical Vibrations
• Low Latency
The ST100 includes two chips (chipset).
ST100M – hybrid package including a MEMS speaker, a MEMS microphone and mic readout circuit.
ST100A – amplifier receiving a digital audio signal and driving the MEMS speaker.
| SPL@20Hz | SPL@1KHz | SPL@10KHz | Units | |
|---|---|---|---|---|
| IEC 60318-4 | 143 | 115 | 110 | dB |
| Specification | IEC 60318-4 |
|---|---|
| SPL@20Hz | 157 dB |
| SPL@1KHz | 123 dB |
| SPL@10KHz | 118 dB |
Traditional noise cancelation systems (ANC/ENC) performance is limited by speaker/microphone placement. SonicTwin reduces latency and enables better functionality.
The modulated ultrasound technology replaces traditional voice coils, resulting in higher efficiency, superior sound quality, and co-packaged sensors—all in a size once thought impossible.
What can best be described as “can sound", due to acoustic resonance in the enclosed earbud space and interference between closely placed speakers and microphone - where users experience a hollow, tunnel-like sound quality similar to hearing audio through a tin can - is eliminated.
The modulated ultrasound technology replaces traditional voice coils, resulting in higher efficiency, superior sound quality, and co-packaged sensors—all in a size once thought impossible
Early experiments with MEMS technology yielded speakers that could not deliver the full range of audio, and had particularly problems adding bass. Others have tried to solve these problems with MEMS/voice coil hybrid speakers, a solution that doesn’t permit for the tiny size that may be the greatest promise of the new tech. In 2nd Gen MEMS a small speaker generates ultrasound. The ultrasound propagates through a time varying acoustic channel that acts as acoustic modulator. A large channel enables the ultrasound to pass and a small channel attenuates the ultrasound. The modulator shifts the ultrasound frequency to create sound.
HQ and MEMS development
HaMelachaSt 4
Binyamina-Giv’at Ada
Israel
ASIC development
DTU Science Park
2800 Kongens Lyngby
Denmark
CVR: 43 12 08 32
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