Sonic Edge MEMS earphone driver module ST100 in Active Noise Control (ANC) feedback application 3.0

  • The driver/speaker technology for earphones has for a long time been dominated by the moving coil principle and has been refined and miniaturized until a kind of size limit seems to have reached at a diameter of approx. Ø5mm. This is for sure a very small component but compared to the size of the human ear canal on aver- age (Ø6mm, length 25mm & slightly S shaped), this is still too big a component to be placed inside, or even at the entrance of the ear canal.

This keeping in mind, that the driver needs to be “packed” into an earphone housing and con- taining the soft tip interfacing to the ear, which of course also occupies space in the device. There are however other driver technologies such as the Balanced Armature initially devel- oped for the hearing instrument industry and lately the MEMS (Micro-Electro-Mechanical System) driver based on the silicon chip industry production processes.

This White Paper will embrace the topic of taking advantage of the latest MEMS driver develop- ment in high performance ear- phones embedding Active Noise Control as a part of a MEMS driver/microphone module.

Get the full White Paper
SonicEdge Ltd

HQ and MEMS development
HaMelachaSt 4
Binyamina-Giv’at Ada
Israel

SonicEdge DK APS

ASIC development
DTU Science Park
2800 Kongens Lyngby
Denmark

CVR: 43 12 08 32

Discover how the ST100 module redefines
in-ear feedback ANC.

As true wireless stereo (TWS) earphones shrink and user expectations grow, engineers face mounting challenges in delivering reliable Active Noise Control (ANC) within tighter spaces. Our latest white paper explores how the SonicEdge ST100 MEMS driver/microphone module overcomes key barriers in phase response, group delay, and latency—delivering a measurable boost in ANC performance.

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