The Future Sounds Incredible (When Employing Ultrasonic Speaker Technology)

  • In addition to being smaller and consuming less power than existing speakers, another exciting aspect of all this is scalability. The SE1000 (with 1 speaker chip as shown above) is ideal for use in earbuds (one SE1000 for each ear). The SE2000 (with 4 speaker chips) can be used in headphones (one SE2000 for each ear). The SE3000 (with 4 speaker chips plus added acoustics) is applicable to virtual reality (VR) and augmented reality (AR) glasses, goggles, and headsets. And the SE4000/SE5000 (with 4/8 speaker chips plus added acoustics) will transform smartphones and tablet computers into audiophiles’ dream devices.

I’ve said it many times before, and I’ll doubtless say it many times again—I’m a simple man who likes a simple story—something I can wrap my poor old noggin around without tears of confusion rolling down my cheeks and sans my brains leaking out of my ears.

Happily, the tale I’m poised to impart is simple in concept, which is not to minimize the awesomeness of the underlying technology.

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SonicEdge Ltd

HQ and MEMS development
HaMelachaSt 4
Binyamina-Giv’at Ada
Israel

SonicEdge DK APS

ASIC development
DTU Science Park
2800 Kongens Lyngby
Denmark

CVR: 43 12 08 32

Discover how the ST100 module redefines
in-ear feedback ANC.

As true wireless stereo (TWS) earphones shrink and user expectations grow, engineers face mounting challenges in delivering reliable Active Noise Control (ANC) within tighter spaces. Our latest white paper explores how the SonicEdge ST100 MEMS driver/microphone module overcomes key barriers in phase response, group delay, and latency—delivering a measurable boost in ANC performance.

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